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Dielectric strength of insulating material in LN2 with thermally induced bubbles

  • To realize a reliable and cost-effective application of high-temperature superconductive (HTS) equipment at high-voltage (HV) levels, the influence of thermally induced gas bubbles on the dielectric strength of different solid insulating materials in liquid nitrogen (LN2) was investigated. A heatable copper tape electrode arrangement was developed simulating HTS tapes with insulation in between. AC breakdown measurements were performed without and with forced boiling on insulating papers, polypropylene laminated paper (PPLP) and polyimide (PI) films. Under nucleate boiling the influence of bubbles on the dielectric strength of all materials was not significant. However under film boiling the dielectric strength of the insulating papers decreased to a level comparable to their dielectric strength in air, demonstrating the insufficient impregnation of porous materials under film boiling. For PI there was no degradation at all. PPLP retained about 70% of its basic dielectric strength in LN2.

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Metadaten
Verfasserangaben:Dirk Gromoll, Ralph Schumacher, Christof Humpert
URN:urn:nbn:de:hbz:832-epub4-19795
DOI:https://doi.org/10.1088/1742-6596/1559/1/012087
ISSN:1742-6588
ISSN:1742-6596
Titel des übergeordneten Werkes (Englisch):Journal of Physics: Conference Series
Verlag:IOP Publishing
Dokumentart:Wissenschaftlicher Artikel
Sprache:Englisch
Datum der Veröffentlichung:01.06.2020
Datum der Freigabe:27.06.2022
Jahrgang:1559
Ausgabe / Heft:1
Seitenzahl:11
Fakultäten und Zentrale Einrichtungen:Informations-, Medien- und Elektrotechnik (F07) / Fakultät 07 / Institut für Elektrische Energietechnik
DDC-Sachgruppen:500 Naturwissenschaften und Mathematik
Lizenz (Deutsch):License LogoCreative Commons - CC BY - Namensnennung 4.0 International